{"cvss":0.0,"datePublished":"2023-12-05T00:00:00Z","dateUpdated":"2023-12-05T00:00:00Z","description":"Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.","dueDate":"2023-12-26T00:00:00Z","id":"CVE-2023-33063","kev_catalogs":["vulncheck"],"knownRansomwareCampaignUse":"Unknown","product":"Multiple Chipsets","requiredAction":"Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.","severity":"HIGH","source":"vulncheck_kev","title":"Qualcomm Multiple Chipsets Use-After-Free Vulnerability","vendor":"Qualcomm"}