{
  "cvss": 0.0,
  "datePublished": "2023-12-05T00:00:00Z",
  "dateUpdated": "2023-12-05T00:00:00Z",
  "description": "Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.",
  "dueDate": "2023-12-26T00:00:00Z",
  "id": "CVE-2023-33063",
  "kev_catalogs": [
    "vulncheck"
  ],
  "knownRansomwareCampaignUse": "Unknown",
  "product": "Multiple Chipsets",
  "requiredAction": "Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.",
  "severity": "HIGH",
  "source": "vulncheck_kev",
  "title": "Qualcomm Multiple Chipsets Use-After-Free Vulnerability",
  "vendor": "Qualcomm"
}